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Essmetuin sac305 sn96.5ag3.0cu0.5 217℃ high temp tin lead-free solder paste, no-clean high thermal conductivity and conductivity tin paste for cell phone pcb/ic/bga/smd cpu repairing(30g)

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Essmetuin SAC305 Sn96.5Ag3.0Cu0.5 217℃ High Temp Tin Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(30G) image 1
₹2432
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Amazon Price History - Essmetuin sac305 sn96 5 ag3 0 cu0 5 217 high temp
From: 30 May 2025 to 12 Nov 2025

amazon.in Essmetuin SAC305 Sn96.5Ag3.0Cu0.5 217℃ High Temp Tin Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(30G) Price History Graph from 30 May 2025 to 12 Nov 2025

amazon.in Price History Table - Essmetuin SAC305 Sn96.5Ag3.0Cu0.5 217℃ High Temp ...

NoTimePriceChange
112 Nov 20252432
-237
230 May 20252669 

Product Info

FeatureValue
StoreAmazon.in
Amazon Reviews
44
Amazon Rating
4/5
Lowest Price Detected₹ 2432
Lowest Price Date12 nov 2025
Best Price Was About3 days ago
Price History Available Since30 May 2025

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